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TTM Achieves AEC-Q200 Qualification for Mini-Xinger® RF Product Portfolio

06/17/2026 | Globe Newswire
TTM Technologies, Inc. announced that its Mini-Xinger® product portfolio has achieved AEC-Q200 qualification accreditation, a significant milestone validating the product line’s conformance to the highest standards of passive component reliability for automotive and high-reliability applications.

Airbus: France Launches Development of New Capabilities for A400M

06/16/2026 | Airbus
Airbus Defence and Space has signed a contract with OCCAR (Organisation for Joint Armament Cooperation), acting on behalf of the French Directorate General of Armaments (DGA), for the development of new capabilities for the A400M.

STARTEAM GLOBAL Achieves ISO 14064 GHG Verification

06/05/2026 | STARTEAM GLOBAL
We are pleased to share that STARTEAM GLOBAL has successfully completed the ISO 14064 Greenhouse Gas (GHG) verification audit, conducted by BSI, with no outstanding nonconformities.

American Standard Circuits to Exhibit at IMS 2026 in Boston

06/02/2026 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits, has announced that the company will be exhibiting at IMS 2026, the world’s leading event for RF, microwave, and high-frequency technologies, taking place June 8th through June 13th, 2026, at the Thomas M. Menina Convention and Exhibition Center in Boston, Massachusetts.

Dow Launches DOWSIL TC-3120 Thermal Gel for Optimum Heat Transfer for Optical Modules, Dense Electronics and High-speed Data Applications

06/01/2026 | Dow
Dow has announced the launch of DOWSIL™ TC-3120 Thermal Gel, a silicone-based material designed to optimize heat transfers and provide optical-grade cleanliness. It has the highest thermal conductivity (~12 W/m·K) among Dow’s commercially available silicone gels and is designed to minimize oil bleeding and condensed outgassing – contaminants that can reduce the reliability of optics and electronics.
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