Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
It’s Only Common Sense: Stop Chasing New Customers and Start Keeping the Ones You Have
Driving Innovation: Inner Layer Alignment Methods in PCB Production
OSI Systems Receives $7 Million Order for Medical Technology Components
May 13, 2025 | BUSINESS WIREEstimated reading time: Less than a minute
OSI Systems, Inc. announced that its Optoelectronics and Manufacturing division has been awarded an order for approximately $7 million to supply essential components for a leading healthcare innovator specializing in patient diagnostic and care applications.
Ajay Mehra, OSI Systems’ President and Chief Executive Officer, commented, "We are thrilled to capture this order from this long-term customer and look forward to supporting their leading medical solutions."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
07/23/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
Federal Electronics Continues to Enhance Inspection Capabilities at Hermosillo Facility: Installs New Mycronic PI Primo M 3D SPI System
07/22/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Mycronic PI Primo M 3D Solder Paste Inspection (SPI) system at its Hermosillo, Mexico facility, advancing the site’s precision inspection and process control capabilities.
Federal Electronics Invests in HydroJet Inline Cleaning Technology at Hermosillo Facility
07/15/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has strengthened the advanced cleaning capabilities of its Hermosillo, Mexico facility with the recent installation of a HydroJet Inline Cleaner from Austin American Technology (AAT).
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.