-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
May 14, 2025 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
“Now that we have our ASC Sunstone Circuits division in Oregon, this show is of particular importance to us. It has always been a successful event for them in the past and we look forward to having a variety of members from both teams on hand to meet with customers and prospects. It will be a great opportunity for us to display the complete portfolio of services and products that our combined locations offer our customers,” commented Vardya when making the announcement.
Anaya Vardya will be participating in a panel discussion at 2 PM at the event as well.
Navigating the Landscape of PCB Surface Finishes: innovations, Challenges, and Best Practices
Panelists:
- Akhil Kumar, Intel Corporation
- Anaya Vardya, American Standard Circuits
- Kunal Shah, Lilotree
- Rob Rowland, Axiom Electronics
Description: This panel will explore the evolving landscape of PCB surface finishes, highlighting recent innovations that enhance performance and reliability. It will expound on the challenges faced by engineers in selecting the optimal finish amidst diverse options like HASL, ENIG, ENEPIG, ImAg and OSP. Attendees will gain insights into best practices for balancing cost, functionality, sustainability and environmental considerations in surface finish selection. Examples of Failure analysis on defects, root caused to the surface finish, will be illustrated. By understanding these dynamics, participants can make informed decisions that drive successful PCB design and manufacturing outcomes.
Be sure to visit ASC on the show floor.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Vuzix Ships Follow-On Production Order from Major Defense Customer for Waveguide-Based AR
04/06/2026 | PRNewswireVuzix® Corporation, a leading supplier of AI-powered smart glasses, waveguides, and augmented reality technologies, announced that it has received and shipped against a new six-figure follow-on production order for waveguide-based AR display systems from a U.S.-based company that is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/18/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
03/06/2026 | I-Connect007I-Connect007 announces the release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new book offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/10/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. This comprehensive guide explores smarter access strategies for today’s high-density designs, including boundary scan, built-in self-test (BIST), flying probe, in-circuit test (ICT), and functional testing. Central to the book is the PCOLA-SOQ framework, a structured, measurable method for evaluating inspection and test coverage at both the component and pin levels.