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New Podcast Episode Drop: Understanding How Chemistry and Drilling Collaborate for OTI
August 7, 2025 | I-Connect007Estimated reading time: Less than a minute

MKS’ Atotech’s Frank Bruening (GM) and Roger Massey (Senior Manager, Strategic Planning) join On the Line With… host Nolan Johnson to unpack the growing complexities of achieving optimal interconnect and the critical role chemistry plays. Their discussion highlights the interplay between laser drilling, substrate layer chemistry, and plating processes, offering valuable insights for engineers.
This series explores how MKS is redefining microvia formation to meet the demands of today’s most advanced HDI PCB and substrate designs.
A downloadable companion guide provides a deeper technical dive into the unified via formation methodology, featuring case studies that demonstrate the measurable benefits of OTI.
Stay tuned—new episodes launch every other Thursday!
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Brent Fischthal - Koh YoungSuggested Items
MKS Inc. Reports Q2 2025 Financial Results
08/07/2025 | MKS Inc.MKS Inc., a global provider of enabling technologies that transform our world, reported its financial results for the second quarter of 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.