Dan’s Biz Bookshelf: ‘Atomic Habits’
Happy’s Tech Talk #48: Digital Twins—Integrating Design and Manufacturing
The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps
In Pursuit of Perfection (Reducing Defects)
For bare PCB board fabrication, reducing defects is largely equivalent to a company's bottom line profitability.
Since bare printed circuit board fabrication involves many complex processing steps—from the preparation of materials to the etching of copper and the creation of vias and pads—there is much that can go wrong if processes are not tightly controlled.
This is especially true as technology becomes smaller and more challenging, with even “minor” things affecting a product’s long-term reliability. “Passing” in the shop doesn’t necessarily avert field failures down the line.
In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.
- Take a look inside...
- Add a copy to your digital library for future reference
