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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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In Pursuit of Perfection: Defect Reduction—May 2025 PCB007 Magazine Now Available
May 15, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In Pursuit of Perfection (Reducing Defects)
For bare PCB board fabrication, reducing defects is largely equivalent to a company's bottom line profitability.
Since bare printed circuit board fabrication involves many complex processing steps—from the preparation of materials to the etching of copper and the creation of vias and pads—there is much that can go wrong if processes are not tightly controlled.
This is especially true as technology becomes smaller and more challenging, with even “minor” things affecting a product’s long-term reliability. “Passing” in the shop doesn’t necessarily avert field failures down the line.
In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.
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Molex Accelerates Supply Chain Transformation with Celonis AI
04/17/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.
Molex Accelerates Supply Chain Transformation with Celonis AI
04/16/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.
Elsyca Acquires Hivelix to Strengthen Simulation Platform for Electrochemical Surface Engineering
04/03/2026 | ElsycaElsyca, a global pioneer in computer-aided engineering (CAE) simulation for electrochemical processes and surface finishing, announces the acquisition of Hivelix, a specialist in advanced surface treatment simulation with strong expertise in multiphysics modelling and AI-assisted process optimisation.
New IPC Standards Released
02/23/2026 | Global Electronics AssociationEach quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q1 2026.
Rehm Showcases Future Technologies for Electronics Manufacturing Live at APEX EXPO 2026
02/11/2026 | Rehm Thermal SystemsRehm Thermal Systems will present current solutions for conformal coating and dispensing, resource-efficient vapor phase soldering, and nitrogen reflow soldering. Visit us at booth 942 and experience our technologies live on site.