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Creation Technologies Celebrates Ribbon Cutting of Expanded Denver Product Realization Center
May 19, 2025 | Creation TechnologiesEstimated reading time: 1 minute
Creation Technologies, an end-to-end, scalable Specialty Global Electronic Manufacturing Services provider, proudly celebrated the official ribbon-cutting ceremony of its newly expanded Denver Product Realization Center on Monday, May 12, 2025. The event marked a key milestone in Creation’s continued growth and investment in its rapid prototyping and low-volume manufacturing capabilities.
The 40% expansion increases the facility’s footprint to 45,000 square feet and supports the rising demand from customers in Aerospace & Defense, Medical Devices, and Tech Industrial markets. The Westminster-based site now offers expanded space for engineering services, test development, and manufacturing, while maintaining its focus on quick-turn prototype builds and small-batch production.
“We’re excited to celebrate this next chapter for our Denver team,” said Patrick L. Freytag, CEO of Creation Technologies. “The expansion enhances our ability to support customers launching complex, high-reliability products, and reflects the extraordinary performance of this team in delivering speed, quality, and innovation.”
As Creation’s Product Realization Center, the Denver site is uniquely equipped to support early-stage design and development efforts with services that include:
- Engineering prototype builds
- Design for Manufacturing and Test reviews
- Advanced SMT production with three identical MyData lines, one dedicated to prototyping
- Electro-mechanical assembly, conformal coating, functional testing, and full system integration
The site employs over 100 professionals, including dedicated engineering, quality, program management, and supply chain teams. With certifications including ISO 9001, ISO 13485, AS9100D, ITAR registration, and J-STD Rev H Space Addendum, the facility operates at the highest levels of quality and regulatory compliance.
The ribbon-cutting ceremony brought together Creation leadership, team members, customers and community partners to commemorate the site’s growth and highlight its vital role in helping customers bring new products to market efficiently and reliably.
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Sweeney Ng - CEE PCBSuggested Items
Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Benchmark Announces Appointment of Chuck Swoboda to Board of Directors
08/05/2025 | Benchmark Electronics Inc.Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced the appointment of Charles “Chuck” Swoboda to its Board of Directors.
Federal Electronics Marks 10th Year of ISO 13485 Certification with Successful 2025 Surveillance Audit
08/05/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has successfully completed its 2025 ISO 13485:2016 surveillance audit at the company’s Cranston, Rhode Island facility.
Report: Green Electronics Market to Hit $46.53B by 2029
08/05/2025 | Globe NewswireAccording to the Green Electronics Manufacturing Market Report 2025, this sector will grow from $16.81 billion in 2024 to $20.66 billion in 2025 at a compound annual growth rate (CAGR) of 22.9%.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.