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With funding awards under the U.S. CHIPS and Science Act currently under review, IPC just shared a new Industry Intelligence Report focused on the issues and players involved.
Lead or Lag: The U.S. Imperative in the Global Chip Race recaps every major public- and private-sector commitment shaping the semiconductor landscape – and asks what it will take for the United States to maintain its momentum.
“With CHIPS Act awards under review, any slowdown or reshuffle risks eroding U.S. momentum just as global competition is intensifying,” says Chris Mitchell, IPC vice president of global government relations. “Meanwhile, the rest of the electronics ecosystem is being neglected, undermining the overall effort. The U.S. needs to maintain its momentum and adopt a broader ‘silicon-to-systems’ strategy.”
The report’s findings at a glance:
- Capital vs. capacity: The CHIPS Act has already seeded 90 announced projects across 28 states, backed by $36 billion in federal awards and far larger private outlays. An estimated 58 000 new jobs in the pipeline.
- Back-end bottleneck: Advanced packaging and high-performance substrates remain under-funded in the U.S., even as front-end fabs accelerate.
- Global competition: Rival initiatives include China’s $47.5 billion “Big Fund 3,” Europe’s €43 billion Chips Act program, Japan’s planned ¥10 trillion (≈$65 billion) in support through 2030, and South Korea’s $450 billion ten-year strategy—each targeting gaps that the U.S. still faces.
Visit IPC News Center for more information.
