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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC Report Recaps Imperatives in Global Chip Race
May 19, 2025 | IPCEstimated reading time: 1 minute
With funding awards under the U.S. CHIPS and Science Act currently under review, IPC just shared a new Industry Intelligence Report focused on the issues and players involved.
Lead or Lag: The U.S. Imperative in the Global Chip Race recaps every major public- and private-sector commitment shaping the semiconductor landscape – and asks what it will take for the United States to maintain its momentum.
“With CHIPS Act awards under review, any slowdown or reshuffle risks eroding U.S. momentum just as global competition is intensifying,” says Chris Mitchell, IPC vice president of global government relations. “Meanwhile, the rest of the electronics ecosystem is being neglected, undermining the overall effort. The U.S. needs to maintain its momentum and adopt a broader ‘silicon-to-systems’ strategy.”
The report’s findings at a glance:
- Capital vs. capacity: The CHIPS Act has already seeded 90 announced projects across 28 states, backed by $36 billion in federal awards and far larger private outlays. An estimated 58 000 new jobs in the pipeline.
- Back-end bottleneck: Advanced packaging and high-performance substrates remain under-funded in the U.S., even as front-end fabs accelerate.
- Global competition: Rival initiatives include China’s $47.5 billion “Big Fund 3,” Europe’s €43 billion Chips Act program, Japan’s planned ¥10 trillion (≈$65 billion) in support through 2030, and South Korea’s $450 billion ten-year strategy—each targeting gaps that the U.S. still faces.
Visit IPC News Center for more information.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Electronics Manufacturing Powers U.S. Growth, Supporting 5.2 Million Jobs and $1.8 Trillion in Output
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