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Wolfspeed Launches Next-Gen AI Data Center Packaging with 300mm SiC Technology

03/26/2026 | Wolfspeed
Wolfspeed, Inc. , a global leader in silicon carbide technology, announced that its 300 mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade.

Renesas Announces Expected Loss Resulting from Signing Restructuring Support Agreement with Wolfspeed

06/27/2025 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it has entered into a Restructuring Support Agreement with Wolfspeed, Inc. and its principal creditors for the financial restructuring of Wolfspeed. As a result, Renesas expects to record a loss as described below.

Renesas Announces Expected Loss Resulting from Signing Restructuring Support Agreement with Wolfspeed

06/24/2025 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it has entered into a Restructuring Support Agreement with Wolfspeed, Inc. and its principal creditors for the financial restructuring of Wolfspeed. As a result, Renesas expects to record a loss as described below.

Wolfspeed Announces Executive Leadership Change

05/02/2025 | Wolfspeed
Wolfspeed, Inc. announced that it has mutually agreed with Neill Reynolds to conclude his role as Executive Vice President and Chief Financial Officer, effective May 30, 2025, to pursue another professional opportunity.

Infineon, Wolfspeed Expand and Extend Multi-Year SiC 150mm Wafer Supply Agreement

01/23/2024 | BUSINESS WIRE
Infineon Technologies AG, a global semiconductor leader in power systems and IoT, and Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018.
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