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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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NEDME 2025 Announces Diverse and Distinguished Speaker Lineup
May 19, 2025 | ASC SunstoneEstimated reading time: 1 minute
The Northwest Electronics Design & Manufacturing Expo (NEDME) is thrilled to announce the impressive speaker lineup for the upcoming 2025 event. Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center in Hillsboro, Oregon, NEDME 2025 will feature a dynamic array of thought leaders from across the electronics design and manufacturing sectors.
Keynote and Featured Speakers
- James Clarke - Director of Quantum Hardware, Intel Corporation
- Lupita Maurer - President, Polar Instruments
Session and Panel Speakers
- Kevin Beattie - Production Manager, ASC Sunstone Circuits
- Debbie Benke - Director of Quality Assurance, Axiom Electronics
- Dr. Isil Berkun - Founder, DigiFab AI
- Pat Duggan - Sales Engineer and Distribution Manager, Temco Northwest
- Mike Galloway - Sr. Manufacturing Engineer, Screaming Circuits
- Darren Hitchcock - Sr. Business Development Manager, Panasonic Electronic Materials
- Jim Kaigh - Outsourced VP of Growth, Sales Xceleration
- Gregory Kovsky - President, International Business Associates (IBA)
- Brandon Patton - President, Lakehouse Industries
- Gabrielle Proust - Principal, The Efficiency Godmother
- Mike Schindele - Director of Operations, DZYNE Technologies
- Mark Veary - Director of Engineering, Fusion EMS
- Jerry Vieira - President & Founder, The QMP Group
- Justin Wagner - Patent Attorney, McCoy Russell LLP
- Blaine Watson - Director, designPORT
- Leonard Weitman - Principal Consultant, Weitman Consulting
- Angela Wilhelms - President & CEO, Oregon Business & Industry (OBI)
- Laura Zager - Director, IP Counsel for Software and AI, Thermo Fisher Scientific
Event Details
- Date: Wednesday, October 22, 2025
- Time: 8:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center, Hillsboro, OR
Exhibitor Registration: Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now. Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics sector.
For more information and to secure your spot, visit www.nedme.com.
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Simon Khesin - Schmoll MaschinenSuggested Items
Neways Begins Delivery of Saab’s UTAAS Integrated Sight and Fire Control Systems
02/11/2026 | NewaysNeways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, has started production and delivery of critical sub-systems for Saab’s UTAAS (Universal Tank and Anti-Aircraft System) integrated sight and fire control systems for BAE Systems’ CV90 infantry fighting vehicles.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
02/10/2026 | TrendForceGoogle’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.
Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing
02/09/2026 | QnityQnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/06/2026 | Nolan Johnson, I-Connect007Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.