It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
SMTA Symposium on Counterfeit Parts & Materials Program Finalized
May 21, 2025 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce the technical program for the Symposium on Counterfeit Parts & Materials. Co-organized by SMTA and the Center for Advanced Life Cycle Engineering (CALCE), the event will be held June 24-26, 2025 in Hyattsville, Maryland at the College Park Marriott Conference Center.
The technical program includes two semiconductor-focused keynote presentations. Other sessions will address trusted sources, technology, testing/accreditation, global perspectives, legal/policy issues, independent distributor concerns, and machine learning standards.
Matthew Hicks, Sr. Director of Foundries, Test & Advanced Packaging (FTAP) at Northrop Grumman, will provide the opening keynote presentation on Tuesday, June 24, 2025. Hicks’ presentation is titled, “Microelectronics Powering America's Defense.”
Chuck Woychik, NHanced Semiconductors, will keynote the second day of the symposium with his presentation, “A Global View Versus a U.S. Focus on Outsourced Assembly and Test (OAST) Facilities to Support Wafer-Level Packaging.”
The symposium concludes on Thursday, June 26, with three professional development courses. A full-day course titled “Counterfeit Parts Detection Using SAE AS6171”, is instructed by Michael Azarian, Ph.D., CALCE, University of Maryland. Peter Sandborn, Ph.D., instructs a concurrent half-day course in the morning titled, “Electronic Part Obsolescence Forecasting, Mitigation and Management.” Diganta Das, Ph.D., CALCE, University of Maryland, will instruct the afternoon course titled, “Use of Component Documentation and Supply Chain for Counterfeit Avoidance.
Registration for this event is now open. Discounted rates are available when registering by Friday, May 23. Access to the two-day symposium and professional development courses are included in the standard conference package, details are available on the registration page.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.