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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Dymax to Showcase Light-Cure Solutions at The European Battery Show 2025
May 23, 2025 | Dymax CorporationEstimated reading time: 2 minutes
Dymax, a global manufacturer of rapid light-curing materials and equipment, will exhibit at The European Battery Show 2025 in Stand 4-C60. This premier event, taking place June 3–5 at Messe Stuttgart in Stuttgart, Germany, will feature the latest advancements in EV and hybrid vehicles as well as energy storage technology.
At the upcoming event, Dymax will feature its recently developed light-curable materials engineered for high-tech EV batteries, emphasizing advancements in battery bonding and PCB coating solutions. As demand for electric vehicles and sustainable energy solutions accelerates across Europe, manufacturers face increasing pressure to enhance reliability while reducing production time and costs. To support this growing need, the company will present technologies for SOFC and PEM fuel cells and electrolyzers.
Dymax’s advanced materials, designed to protect critical electric vehicle BMS components from extreme environments, corrosion, and chemicals, will particularly interest engineers. Materials include adhesives for the structural bonding of EV battery cells and dual-cure conformal coatings for protecting sensitive PCB circuitry. These products can help improve and extend the life of electric vehicle batteries by increasing their responsiveness and dependability.
Also available for review will be a selection of fast-curing adhesives, coatings, and gasket sealants, designed to meet the demanding needs of fuel cell manufacturers and assemblers. The materials are engineered to provide structural integrity, prevent leaks and contamination, and shield components from high operating temperatures and harsh environments, while streamlining production and reducing costs. Dymax BlueWave LED light-curing systems will be available to aid in both hands-on and robot-driven demonstrations of key products and technologies.
“We’re looking forward to introducing our latest light-curable technologies to visitors,” said Christian Gruber, Field Service Engineering Manager EMEA at Dymax. “Our high-performance materials can help EV battery and fuel cell manufacturers improve assembly process efficiency and durability. It’s a great opportunity to connect with industry leaders and explore how Dymax solutions support the advancement of electric vehicle and fuel cell energy systems.”
Technical experts will be on hand to discuss customers' unique applications and how Dymax products offer rapid cure times to help shorten production cycle times and increase throughput—all without compromising quality.
The company is committed to developing advanced technological solutions that address the evolving needs of both the electric vehicle and energy storage sectors, helping manufacturers meet the demands of these rapidly growing industries.
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Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic-Hesselink, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
AI Demand Drives PCB Material Market Growth
05/08/2026 | TPCAAs AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation.