ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing

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ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging. The two companies will leverage their respective semiconductor chemistry expertise to create innovative solvent solutions for a range of advanced semiconductor and packaging process applications.

The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices. NMP, or N-Methylpyrrolidone, is a chemical compound long used in a variety of industries, including semiconductor fabrication, for removal of surface materials.

ClassOne has been a strategic supplier to IBM since 2014, developing technologies in electroplating, metal lift-off (MLO) and wet cleaning processes, and subsequently expanding to advanced packaging applications.

ClassOne CEO Byron Exarcos noted, “This collaboration represents a significant step forward in developing alternatives for advanced semiconductor processing. Combining our flexible wafer-processing platform and seasoned team with IBM’s extensive research experience and resources will result in novel solutions that we look forward to sharing throughout our industry.”