Dan’s Biz Bookshelf: 'A View from the Top: Moving from Success to Significance'
The Chemical Connection: The Practice of Doing Business in Foreign Lands
It’s Only Common Sense: Pricing PCBs? It’s All in Their Heads
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
May 26, 2025 | ClassOne TechnologyEstimated reading time: Less than a minute
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging. The two companies will leverage their respective semiconductor chemistry expertise to create innovative solvent solutions for a range of advanced semiconductor and packaging process applications.
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices. NMP, or N-Methylpyrrolidone, is a chemical compound long used in a variety of industries, including semiconductor fabrication, for removal of surface materials.
ClassOne has been a strategic supplier to IBM since 2014, developing technologies in electroplating, metal lift-off (MLO) and wet cleaning processes, and subsequently expanding to advanced packaging applications.
ClassOne CEO Byron Exarcos noted, “This collaboration represents a significant step forward in developing alternatives for advanced semiconductor processing. Combining our flexible wafer-processing platform and seasoned team with IBM’s extensive research experience and resources will result in novel solutions that we look forward to sharing throughout our industry.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Semicon Coalition & industry: A United Front to Power Europe’s Semiconductor Future
10/02/2025 | ESIAIn a clear signal of unity and shared ambition, the ‘Semiconductor Coalition Europe’ unveiled its Joint Declaration that seeks to strengthen and revitalise Europe’s position in the global semiconductor industry.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/01/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
UST, Kaynes Semicon Partner to Set Up Rs 3,330 Crore Joint Venture for Semiconductor Manufacturing in India
09/30/2025 | PRNewswireUST, a leading AI and technology transformation solutions company, has announced a strategic investment in Kaynes Semicon, a prominent Indian semiconductor manufacturer.
European Semiconductor Industry Endorses Semicon Coalition's Call for Revised EU Chips Act - Cloned
09/30/2025 | SEMISEMI Europe, along with over 75 semiconductor and microelectronics companies, research and technology organizations (RTOs) and trade associations, officially endorse the Declaration of the Semicon Coalition.
SEALSQ, Kaynes SemiCon Announce Joint Venture to Establish India's First Secure Semiconductor Center
09/30/2025 | Globe NewswireSEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products,, a subsidiary of WISeKey International Holding AG , a global leader in cybersecurity, digital identity, and IoT solutions platform, announced the signing of a Term Sheet with Kaynes SemiCon to form a Joint Venture company, SEALKAYNESQ Ltd, to be established in India.