Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
May 27, 2025 | Polar InstrumentsEstimated reading time: 1 minute

Polar Instruments' latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025. More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed. The traps of extended supply chains, the ever expanding variety of base materials that need to be handled and the challenges of communication of ever more complex multilayer stackups.
With guidance for setting expectations of production tolerances – and an answer to the question “Where is the PCB-making machine?” – the new book gives a useful back story to the life of a PCB to designers who are immersed in electrical specifications. For non-electronics specialists and procurement engineers the information contained perhaps gives a glimpse of the challenges faced by designers too.
With a guest chapter from Bert Simonovich, "Demystifying the modeling of vias and offering an alternative to full 3D via modeling," the book adds to the picture painted by its predecessor The PCB Designer's Guide to... Secrets of High Speed PCBs.
“The PCB Designer's Guide to... More Secrets of High Speed PCBs successfully distracts young engineers from their phones at coffee breaks,” remarks Neil Chamberlain, Signal integrity Product Manager.
Discover how to elevate your PCB design and fabrication process. Learn more and download your copy here.
Suggested Items
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.
Material Selection and RF Design
04/21/2025 | Andy Shaughnessy, Design007 MagazineInnovation rarely sleeps in this industry, and the RF laminate segment offers a perfect example. RF materials have continued to evolve, providing PCB designers much more than an either/or choice. I asked materials expert Alun Morgan, technology ambassador for the Ventec International Group, to walk us through the available RF material sets and how smart material selection can ease the burden on RF designers and design engineers.
EDA Tools and RF Design Techniques
04/14/2025 | Andy Shaughnessy, Design007 MagazineHigh-speed PCB design is complex enough, but RF design can be a whole new ball game. RF designers have to contend with tuning and other ideas that traditional PCB designers don’t have to worry about, as well as crosstalk, parasitic capacitance, and material limitations. Most PCB design tool companies now offer RF design options, so designers no longer have to use pureplay RF design tools for anything but the most cutting-edge designs. Cadence Design Systems expanded its RF EDA offerings by acquiring the RF software company AWR a few years ago. We asked David Vye, product management director at Cadence, to share his thoughts on EDA software, RF design, and what new RF designers and engineers need to understand.
The Key to First-pass Success in PCB Design
04/10/2025 | Gerry Partida, Summit InterconnectIn the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engagement between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry often begins only after problems arise—such as field failures, assembly fallout, or low fabrication yields. This reactive approach is the wrong starting point for collaboration.