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Suggested Items

Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?

09/02/2025 | Dennis Fritz -- Column: Defense Speak Interpreted
In my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: 

Unique Active Memory Computer Purpose-built for AI Science Applications

08/26/2025 | PNNL
With the particular needs of scientists and engineers in mind, researchers at the Department of Energy’s Pacific Northwest National Laboratory have co-designed with Micron a new hardware-software architecture purpose-built for science. 

izmomicro Achieves Breakthrough in Silicon Photonics Packaging, Establishing India's Leadership in Advanced Semiconductor Integration

08/21/2025 | PRNewswire
izmomicro, a specialized division of izmo Ltd., announced a major milestone in silicon photonics packaging, underscoring its role as a pioneer in India's semiconductor ecosystem and advancing the country's position in the global race toward next-generation data and AI infrastructure.

Haylo Labs Acquires Plessey Semiconductors

08/20/2025 | Haylo Labs
Haylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.

American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?

08/19/2025 | Shane Whiteside -- Column: American Made Advocacy
In a world of peer threats and urgent transformation, having secure, trusted, and reliable microelectronics is non-negotiable. While largely hidden, microelectronics are the ubiquitous enablers of modern defense platforms. Nothing in the current American arsenal flies, floats, or fights without a technology stack that includes a semiconductor, an integrated circuit substrate, and a printed circuit board.
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