Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Lightium Selects Aras Innovator to Support Development of Photonic AI Chips

05/12/2026 | BUSINESS WIRE
Aras, a leading provider of digital thread solutions for product lifecycle management (PLM) and engineering AI, announced that Lightium, a Switzerland-based startup specializing in photonic integrated circuits (PICs), has selected Aras Innovator® to establish a connected foundation for managing the complexity of its photonic chip development.

Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware

05/05/2026 | PRNewswire
Xanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.

GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module

05/04/2026 | GlobalFoundries
GlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).

Future-proof Laser Depaneling for PCBs with Photonics

04/10/2026 | Real Time with... APEX EXPO
Bill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in