Indium Joins Virginia Tech Center for Power Electronics Systems Industry Consortium
June 3, 2025 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has joined Virginia Tech’s Center for Power Electronics Systems (CPES), an industry consortium that supports power electronics initiatives to reduce energy use while growing capability.
CPES is dedicated to improving electrical power processing and distribution that impact systems of all sizes, from battery-operated electronics and vehicles to regional and national electrical distribution systems. The organization has a worldwide reputation for its research advances, its work with industry to improve the entire field, and its many talented graduates.
With a specific focus on power device packaging, Indium Corporation continues to advance its portfolio of die-attach, package-attach, and thermal interface materials (TIMs) solutions that are custom-engineered to satisfy the mission profile demands for power electronics applications.
“Advancing materials technology is a key enabler to realize our design goals for power electronics,” said Ryan Mayberry, Senior Application Development Engineer at Indium Corporation. “Through collaboration with CPES, Indium Corporation will leverage innovations in materials science and align research and development initiatives to address future power device requirements.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Infineon to Purchase Long-Term Green Electricity from Wind Farms in Brandenburg, Germany and Solar Plants in Spain
10/27/2025 | InfineonInfineon Technologies AG has concluded Power Purchase Agreements (PPA) with PNE AG and Statkraft for green electricity.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/24/2025 | Andy Shaughnessy, I-Connect007This week, we have quite a bit of international content in this week’s list of must-reads. Nothing happens in a vacuum, including electronics manufacturing and design, and this has been quite an eventful year. How many of us are now tariff experts? I’m certainly not, but that hasn’t stopped me from opining about the situation.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
PDN Optimization: Balancing Performance and Cost in SoC Designs
10/22/2025 | Zach Caprai. Siemens EDAThis article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
Beyond Design: The Fundamental Structure of Spectral Integrity
10/21/2025 | Barry Olney -- Column: Beyond DesignImpedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency domain, AC impedance determines how well the network can suppress noise and deliver clean power at a range of frequencies. AC impedance shapes how power rails respond to transient loads.