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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
June 9, 2025 | Dr. Eyal Weiss, CybordEstimated reading time: 1 minute

As the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
In many modern SMT lines, the pick-and-place machine captures high-resolution bottom-side images of components as part of the placement process. These images represent a unique opportunity: a real-time, untouched view of each component just before it is mounted. Once placed, this view is destroyed—either physically by solder or visually by occlusion. Yet, this is precisely the moment when critical information can be extracted. Issues like corrosion on leads, mechanical damage, probe marks from unauthorized programming, or foreign object debris (FOD) can all be detected from the underside view before the component becomes permanently embedded onto the board.
Inline X-ray systems, which until recently were the only method of optically examining components, are typically used to inspect the outcome: solder joints, alignment, and the presence of voids or bridges. While valuable, these systems focus on symptoms. Without insight into what the component looked like before it was placed, root cause analysis remains incomplete. For example, a void in a solder joint might appear to be a process failure when, in fact, it stems from oxidation or contamination on the component lead, something that could have been spotted ahead of time.
To continue reading this article, which originally appeared in the May 2025 issue of SMT007 Magazine, click here.
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Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years
06/26/2025 | Count On ToolsCount On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
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The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
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Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.