Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
AI-powered Engineering through Seamless CADx Integration
June 11, 2025 | CoreTechnologieEstimated reading time: 1 minute
AI-driven engineering intelligence platform Leo AI and software developer CoreTechnologie announce their cooperation to advance AI-powered engineering through seamless CADx integration.
The Franco-German software developer CoreTechnologie has entered into a cooperation with the AI-driven engineering intelligence platform Leo AI from Cambridge, USA. The strategic technology integration of the new partners enables advanced AI-powered analysis of CADx data on the Leo AI platform through CoreTechnologie's embedded software development kit (SDK) 3D_Kernel_IO.
Automated Analysis
By integrating the SDK into the Leo AI platform, native CAD files from 3D Experience, NX, Creo, Solidworks and neutral formats such as Step and JT are analysed and interpreted using artificial intelligence (AI). The new technology enables engineers and project managers to quickly gain insights using AI models based on CAD data. This automates decision-making with regard to materials, mechanics, coatings or design considerations.
The 3D_Kernel_IO Software Developer Kit was developed for seamless access to multi-CAD data. In combination with artificial intelligence, the integrated solution transforms automation in product development and product lifecycle management (PLM) applications with the help of an AI assistant. With 3D_Kernel_IO, Leo AI can access detailed information from the latest versions of all major CAD formats within seconds.
"Our collaboration with Leo AI is a good example of the use of artificial design intelligence in the future," says Armin Brüning, Managing Director of CoreTechnologie.
"AI is only as powerful as the data it can access," adds Moti Moravia, CTO and co-founder of Leo AI. "By integrating CoreTechnologie's SDK, we have removed the last major barrier between raw 3D data and artificial intelligence. This opens up a new era where AI is actively involved in engineering workflows."
The new software integration between the two partners is already being used in pilot projects in aerospace and advanced manufacturing. Initial successes have been achieved in the automatic classification of parts, risk detection and the analysis of technical changes. The partnership underlines the joint commitment to innovation and future-orientation in intelligent product development.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Sparton Marks 125 Years of Innovation and Leadership in Maritime Defense and Manufacturing Engineering Excellence
10/28/2025 | Sparton Corp.Sparton DeLeon Springs, LLC, an innovative leader in and manufacturer of maritime defense solutions is honoring its 125th anniversary this year.
Airbus, Leonardo and Thales Sign Memorandum of Understanding to Create a Leading European Player in Space
10/28/2025 | AirbusAirbus, Leonardo and Thales have signed a Memorandum of Understanding (MoU) aimed at combining their respective space activities into a new company.
Thales Alenia Space Inaugurates State-of-the-art Space Smart Factory
10/08/2025 | ThalesThales Alenia Space, a joint venture between Thales (67%) and Leonardo (33%), has inaugurated its Space Smart Factory in Rome with a ceremony attended by Italian President Sergio Mattarella. The factory — one of Europe’s largest intelligent, digital, reconfigurable manufacturing facilities — is located at the Tecnopolo Tiburtino high-tech innovation hub in Rome.
RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution
10/07/2025 | Agileo AutomationAgileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance.