-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
June 11, 2025 | Nordson Electronics SolutionsEstimated reading time: 1 minute

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson at Nordson.com.
PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.
PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.
Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.
Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SEMI, Arizona State University Partner to Deliver Cutting-Edge Semiconductor Engineering and AI Education
07/23/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced it has partnered with Arizona State University (ASU) to expand access to high-impact, on-demand training for the global semiconductor workforce.
SEMI Reports Global Total Semiconductor Equipment Sales Forecast to Reach $125.5 Billion in 2025
07/23/2025 | SEMISEMI announced that global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record of $125.5 billion in 2025, a 7.4% year-on-year increase, according to its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective.
xLight Raises $40 Million Series B to Revolutionize Semiconductor Manufacturing
07/22/2025 | BUSINESS WIRExLight, the American company building the world’s most powerful lasers, announced it has closed an oversubscribed $40M Series B equity raise.
Siemens, UMC Collaborate to Advance EM/IR Drop Analysis with mPower Technology
07/22/2025 | SiemensSiemens Digital Industries Software announced that it has collaborated with United Microelectronics Corporation (UMC), a leading global semiconductor foundry, to implement Siemens' mPower™ software for electromigration (EM) and IR drop analysis, enabling chip designers to optimize performance and enhance reliability.
Flip Electronics Unifies Manufacturing Operations Under New Flip Manufacturing Services Brand
07/22/2025 | PRNewswireFlip Electronics, an authorized distributor of obsolete semiconductors and electronic components, announced that it is rebranding its subsidiary, Resurgent Manufacturing Services, to Flip Electronics Manufacturing Services (FMS).