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Webinar: INEMI Printed Circuit Board Roadmap
June 13, 2025 | iNEMIEstimated reading time: 2 minutes

Join INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany, will:
- Review highlights of INEMI’s 10-year roadmap for PCBs, including high-speed PCBs and substrates, laminates, mmWave PCBs, test and inspection, and environmental issues.
- Highlight next steps for the INEMI PCB Roadmap and brainstorm future directions for PCB technology.
About the INEMI Roadmap
The INEMI Roadmap charts — over a 10-year horizon — the future evolution of electronics manufacturing in terms of application and market drivers, technical needs, maturity of technical solutions, expected gaps and challenges. Modern electronic systems and applications drive the iNEMI Roadmap. The various roadmap teams focus on the full product lifecycle, from component design to manufacturing to deployment to end of life, and the complete ecosystem from materials suppliers to system integrators.
About the Speakers
Tarja Rapala-Virtanen
Technical Director, EIPC
Tarja Rapala-Virtanen is a technology professional with more than 25 years of experience in managing complex electronics projects and technology, particularly in the field of printed circuit boards. Her expertise spans various aspects of PCB technology, including interconnection and circuit board technology. She has led global engineering and R&D functions both in Finland and China and is currently the Technical Director of EIPC, the European Institute for the PCB Community. Tarja holds an M.Sc. degree in chemical engineering from Abo Akademi in Turku, Finland.
Joe Beers
Senior Vice President
Gold Circuit Electronics Global Sales and Service
Joe Beers has more than 30 years of experience in the manufacture of printed circuit boards and varied experiences as a laboratory chemist, process and product engineer, quality director and manufacturing leader. At Gold Circuit Electronics he has held a variety of positions in the areas of engineering and quality support. He has worked closely with OEM customers, with a specific focus on materials and processes, coupled with quality management and field experience. Joe graduated with a chemistry degree from Adelphi University in New York.
Registration
This webinar is open to all in the industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. If you have any questions or need additional information, please contact Francis Mullany (fmullany@inemi.org).
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia
07/30/2025 | TPCAAs the global supply chain continues to restructure, Southeast Asia, leveraging its geographical advantages and favorable policies, has become a strategic hub for global circuit board manufacturing.