Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Webinar: INEMI Printed Circuit Board Roadmap
June 13, 2025 | iNEMIEstimated reading time: 2 minutes
Join INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany, will:
- Review highlights of INEMI’s 10-year roadmap for PCBs, including high-speed PCBs and substrates, laminates, mmWave PCBs, test and inspection, and environmental issues.
- Highlight next steps for the INEMI PCB Roadmap and brainstorm future directions for PCB technology.
About the INEMI Roadmap
The INEMI Roadmap charts — over a 10-year horizon — the future evolution of electronics manufacturing in terms of application and market drivers, technical needs, maturity of technical solutions, expected gaps and challenges. Modern electronic systems and applications drive the iNEMI Roadmap. The various roadmap teams focus on the full product lifecycle, from component design to manufacturing to deployment to end of life, and the complete ecosystem from materials suppliers to system integrators.
About the Speakers
Tarja Rapala-Virtanen
Technical Director, EIPC
Tarja Rapala-Virtanen is a technology professional with more than 25 years of experience in managing complex electronics projects and technology, particularly in the field of printed circuit boards. Her expertise spans various aspects of PCB technology, including interconnection and circuit board technology. She has led global engineering and R&D functions both in Finland and China and is currently the Technical Director of EIPC, the European Institute for the PCB Community. Tarja holds an M.Sc. degree in chemical engineering from Abo Akademi in Turku, Finland.
Joe Beers
Senior Vice President
Gold Circuit Electronics Global Sales and Service
Joe Beers has more than 30 years of experience in the manufacture of printed circuit boards and varied experiences as a laboratory chemist, process and product engineer, quality director and manufacturing leader. At Gold Circuit Electronics he has held a variety of positions in the areas of engineering and quality support. He has worked closely with OEM customers, with a specific focus on materials and processes, coupled with quality management and field experience. Joe graduated with a chemistry degree from Adelphi University in New York.
Registration
This webinar is open to all in the industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. If you have any questions or need additional information, please contact Francis Mullany (fmullany@inemi.org).
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
TPCA Launches AI-Powered PCB GPT Knowledge Platform
05/15/2026 | TPCAThe Taiwan Printed Circuit Association (TPCA) has launched the "PCB GPT Industry Knowledge Platform," which uses generative AI to connect PCB professional knowledge services and help the industry improve the efficiency of cross-border and professional talent training.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/15/2026 | Nolan Johnson, I-Connect007When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
STARTEAM GLOBAL Achieves A Score in CDP’s Supplier Engagement Assessment
05/14/2026 | STARTEAM GLOBALSTARTEAM GLOBAL has achieved an A score in CDP’s Supplier Engagement Assessment (SEA).
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
Separating Fact from Fear on the FCC ‘China Lab Ban’
05/14/2026 | Jan Pedersen, NCAB GroupRecent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.