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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Get the ‘Hole Truth’ in New June Issue of PCB007 Magazine
June 16, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
In "The Hole Truth," the new June 2025 issue of PCB007 Magazine explores what it takes to build the “perfect” via—and how to ensure its reliability from the start. Featuring insights from Mike Carano, Stefan Rung, Giovanni Obino, and Happy Holden, this issue is packed with expert takes on advanced inspection, precision drilling (yes, we’re talking pico lasers), and whether it’s time to rethink the cross-section.
Also in this issue:
- Don Ball on vias in glass substrates
- A digital twin white paper excerpt
- ASC’s Anaya Vardya on smart home IoT innovation
- Becky Calwell and Myriam Sullivan on workforce challenges
- Manfred Huschka’s Vietnam case study
- Dan Feinberg’s Hall of Fame series on Lionel Fullwood
Grab your coffee and get the hole story—read the June issue of PCB007 Magazine now!
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Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Nolan’s Notes: Our Spotlight on North America
05/05/2026 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we wrap up our electronics world tour with a final stop in the United States and Canada, where we look at the challenges, opportunities, and geopolitical dynamics affecting the market today. What makes American electronics unique? Key U.S. administration policy decisions, like tariffs, are significantly affecting electronics manufacturing. Others, such as the current conflict with Iran and the associated closures of the Strait of Hormuz, affect the raw materials that feed our supply chain.
May SMT007 Magazine: Putting North America in Focus
05/04/2026 | I-Connect007 Editorial TeamA North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing. Read this issue of SMT007 Magazine now and see where the region is headed.
Mexico’s Wire Harness Pivot Point
04/22/2026 | Nolan Johnson, SMT007 MagazineMexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.