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Suggested Items

Punching Out: How to Stay Focused in Business and M&A

06/23/2026 | Tom Kastner -- Column: Punching Out!
It is getting harder and harder to stay focused these days. In fact, I started writing this column, got an email alert, and six days later, I realized I was still working on the first sentence. Among the hundreds of daily distractions, it is difficult for business owners to stay focused on the important matters. In the middle of all that noise, some owners feel like they have been dragged through a war zone, while others seem like Zen masters.

I-Connect007 Magazine Examines the Balance Between Innovation and Proven Practice

06/16/2026 | I-Connect007 Editorial Team
The debate between old school and new school thinking has existed throughout every era of technological advancement. In the June 2026 issue of I-Connect007 Magazine, we examine how that debate is playing out across today's PCB design, fabrication, and manufacturing landscape.

Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/05/2026 | Marcy LaRont, I-Connect007
It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.

SMT007 Magazine June Issue Focuses on Cleaning, Contamination Control, and Reliability

06/02/2026 | I-Connect007 Editorial Team
SMT007 Magazine’s June issue examines how cleaning processes, contamination control, and reliability engineering are evolving to support highly dense assemblies, advanced packaging, and next-generation electronics manufacturing.
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