Imec, Tokyo Electron Extend Partnership to Accelerate the Development of Beyond-2nm Nodes
June 16, 2025 | ImecEstimated reading time: 2 minutes
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has extended its strategic partnership with Tokyo Electron (TEL), a leading Japanese supplier of semiconductor production equipment. The agreement marks the start of a new five-year phase in their long-standing alliance. It will enable imec and TEL to deepen their joint R&D efforts in key areas such as next-generation patterning, advanced logic device processing, future memory development, and 3D integration – all aimed at developing semiconductor nodes beyond 2nm.
Since 1995, imec and TEL have partnered to drive advances in patterning, logic, memory, and 3D integration. Their long-standing collaboration has led to key breakthroughs in areas such as High NA EUV lithography, etching, wet processing and, deposition. A standout achievement was the joint development of EUV resist coating track technology, which – thanks to its significantly improved defectivity control – has played a pivotal role in enabling the introduction of EUV technology into production.
Building on this foundation, the renewed partnership will focus on co-developing tools and process technologies to support the next wave of semiconductor scaling. Joint efforts will target High NA patterning technologies, aiming to boost performance through optimized material systems and improved defectivity control, as well as advanced deposition and etch solutions for next-generation CFET devices. The agreement also reflects a shared commitment to sustainability, with imec and TEL continuing to explore environmentally responsible manufacturing processes for future semiconductor nodes.
“This extended collaboration is another strong example of imec’s commitment to building international R&D partnerships that benefit the entire semiconductor ecosystem. By deepening our alignment with TEL, we can garner valuable insights that will strengthen other flagship initiatives – such as the NanoIC pilot line under the European Chips Act. Hence, this partnership is truly a win-win: it reinforces TEL’s technology leadership while cementing imec’s position as a global hub for advanced semiconductor research – driving innovation well into the next decade,” said Luc Van den hove, CEO of imec.
“We are pleased to extend our collaboration with imec, a world leader in semiconductor research. This agreement reinforces our commitment to staying at the forefront of innovation while accelerating the development of technologies critical for advanced nodes. By leveraging imec’s expertise in process optimization and sustainability, we are confident we can deliver solutions that meet the performance and environmental demands of our global customer base,” added Toshiki Kawai, President and CEO of Tokyo Electron.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.