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New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
June 19, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute

IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges. He’s committed to fostering collaboration and driving positive change within the electronics industry as he embarks on this new journey.
Marcy LaRont: Joe, it is great to meet you. What is your background, and how did it lead to IPC?
Joe Schneider: I feel that my experiences have prepared me well for this position at IPC. I had a lot of great years at Siemens in multiple industries and multiple businesses, always integrating new acquisitions, which was an exciting challenge. I also met a lot of great people there.
At Abbott Laboratories, I launched diagnostic products, managing everything that comes with the launch of a business division, such as supply chain management and developing the next generation of talent for many different areas. I really enjoyed that experience.
I also have contract manufacturing experience, with two great companies, Sparton and Flex. During my years in contract manufacturing, our manufacturing sites worked with IPC standards, so I grew to appreciate how critical IPC standards are in the electronics industry.
So far, it's been a terrific introduction to IPC. There are a lot of great people here, and I'm excited to contribute and help IPC build an even stronger future in the U.S. and Canada, leveraging the contacts and experience I have gained over these past decades.
LaRont: IPC has a global focus, yet recently committed to a more regional focus to support U.S. and Canadian manufacturing. What are your objectives in this new position?
To continue reading this interview, which originally appeared in the June 2025 edition of SMT007 Magazine, click here.
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Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
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IPC Hall of Fame Spotlight Series: Highlighting Lionel Fullwood
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TRI Unveils New Platform for Diverse Board Sizes
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