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Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups

03/31/2026 | Happy Holden -- Column: Happy’s Tech Talk
Multilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.

Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers 

12/18/2025 | Team NCAB -- Column: Fresh PCB Concepts
When you first learn PCB routing, vias look like plumbing: holes that let signals pass between layers. As designs become denser and products shrink, vias develop from simple interconnects into deliberate engineering choices. Selecting between through-hole, blind, buried, microvia, or advanced options like skip vias is a balancing act between electrical performance, manufacturability, cost, and long-term reliability. In HDI boards, via strategy is as consequential as the stackup, material selection, or component placement. 

Alpha Insights, Performance by Design: An Independent Perspective on the State of HDI Manufacturing

12/16/2025 | Team Alpha -- Column: Alpha Insights: Performance by Design
In today’s electronics landscape—where routing densities continue to rise, and margin for error is shrinking—HDI fabrication has become a defining factor in whether products launch on time and perform as intended. Engineers and program teams now view HDI less as a specialty and more as a foundational requirement, particularly in sectors such as telecom, RF, aerospace, semiconductor test, medical devices, and advanced computing.

Driving Innovation: The Flash Cutting Process

12/08/2025 | Simon Khesin -- Column: Driving Innovation
During the creation of a multilayer board, the lamination process naturally results in excess resin (known as "flash)" being squeezed out and solidified along the sides of the PCB panel. While the consistency and size of this flash provide process engineers with valuable insight into lamination parameters, the flash itself must be completely removed before subsequent manufacturing steps.

Connect the Dots: Evolution of PCB Manufacturing—Lamination

10/02/2025 | Matt Stevenson -- Column: Connect the Dots
When I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
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