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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Target Condition: Signal Integrity Without Borders

06/24/2026 | Kelly Dack -- Column: Target Condition
I started my PCB design career in 1980, long before “signal integrity” became a formal discipline. Back then, we were trying to “connect the dots” on simple, two-sided PCB layouts using the new $80,000 interactive graphics terminals we called a CAD system. By the time PCB design conferences emerged in the 1990s, signal integrity had begun to formalize into a discipline of its own. Much of the early, visible thought leadership came from North America and parts of Europe.

MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste

06/18/2026 | MacDermid Alpha Electronics Solutions
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX® CD 560-1, a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.

Target Condition: The Modern Masters of Signal Integrity and AI-driven Design

05/21/2026 | Kelly Dack -- Column: Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components exhibit edge speeds as fast as 50–100 picoseconds, PCBs behave less like collections of simple traces and more like complex electromagnetic systems.

GreenSource Fabrication to Exhibit at PCB East 2026

04/23/2026 | GreenSource Fabrication
GreenSource Fabrication, the N. American industry’s most advanced, state-of-the-art printed circuit board manufacturer, today announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center 50 Foster Street in Worcester, MA.

Fincantieri to Build Spectre, a New Class of High-Speed Unmanned Surface Vessel

04/21/2026 | BUSINESS WIRE
Fincantieri, through its U.S. subsidiary Fincantieri Marine Group (FMG), will build Spectre, a new class of high-speed, multi-mission unmanned surface vessel (USV), developed by Saildrone, a global leader and the world’s most experienced operator of unmanned surface vehicles.
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