Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

AI Networking and Interconnect Market Projected to Reach US$279.8 Billion in 2027

11/02/2026 | TrendForce
TrendForce's latest AI infrastructure research indicates that the continued expansion of AI server clusters and surging accelerator bandwidth requirements are fueling rapid growth in the global AI networking and interconnect market.

Server CPU Shipments to Grow Over 40% in 2027 as Arm Gains Share

10/23/2026 | TrendForce
TrendForce’s latest AI server industry research indicates that demand for server CPUs has grown steadily since the second half of 2025 as AI service providers actively introduce AI agent applications. Server CPU shipments are projected to increase 31% YoY in 2026. 

Optical Fiber Prices Surge Amid Data Center-Driven Shortages Through 2028

10/19/2026 | TrendForce
AI data centers, data center interconnects, and high-capacity backbone network deployments are driving rising demand for optical fiber

CSP CapEx to Exceed US$1.5T in 2027 as AI Server Revenue Surges

10/14/2026 | TrendForce
Hyperscale CSPs are ramping up investments in servers and AI infrastructure, according to TrendForce’s latest AI server industry research.

Rising Costs Threaten 2027 Notebook Demand

10/08/2026 | TrendForce
TrendForce's latest notebook industry research reveals that the primary risk facing the market in 2027 is expected to shift from supply constraints to the impact of rising costs on demand.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in