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Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
July 23, 2025 | Federal ElectronicsEstimated reading time: 1 minute
Federal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
The MYPro A40DX is Mycronic’s flagship placement platform, designed to handle complex, multi-variant PCB assemblies with exceptional speed and accuracy. It delivers placement rates of up to 48,000 components per hour, combining volume-level throughput with quick changeover flexibility and making it a perfect fit for the dynamic needs of Federal Electronics’ OEM customers.
“This new addition is all about enabling smarter, faster manufacturing,” said Ed Evangelista, President of Federal Electronics. “The A40DX increases our ability to respond quickly to design changes and varied builds without sacrificing precision or quality.”
Federal’s Hermosillo facility plays a pivotal role in the company’s North American operations, offering cost-effective, nearshore manufacturing to OEMs across the U.S. The site is fully integrated with the company’s Cranston, Rhode Island headquarters via a unified ERP and IT infrastructure, ensuring real-time production visibility and synchronized workflows between both locations.
Staffed by more than 350 professionals, the Hermosillo site is optimized for high-mix, high-reliability assembly and currently supports a growing portfolio of AS9100-certified programs. The addition of the A40DX positions the facility to take on increasingly complex builds while maintaining fast turnaround and consistent quality.
This investment reflects Federal Electronics’ ongoing strategy to scale advanced manufacturing across its U.S. – Mexico footprint – supporting customers in aerospace, industrial, and medical sectors with agile, aligned, and high-performance solutions.
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Green Circuits to Discuss Space-Ready Electronics Manufacturing to Space Tech Expo USA
05/12/2026 | Green CircuitsGreen Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, will exhibit at Space Tech Expo USA 2026, taking place June 2–4 in Anaheim.
Fabrinet Announces Q3 Fiscal Year 2026 Financial Results
05/11/2026 | FabrinetFabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its third fiscal quarter ended March 27, 2026.
IMI Reports Q1 2026 Results, Delivering Higher Profitability and Stable YoY Revenue
05/11/2026 | IMIIntegrated Micro-Electronics, Inc. (IMI), a global electronics manufacturing services provider, announced financial results of the first quarter of 2026 highlighting improved profitability and margin expansion, underscoring the effectiveness of its ongoing transformation initiatives despite pockets of market softness in the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.