Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Fuji Launches the Auto Kitting Station

06/12/2026 | Fuji Corporation
Fuji Corporation has developed a new unit, the Auto Kitting Station, which automates the tape reel loading process (kitting process) for feeders used to supply electronic components to machines; a process that has traditionally been difficult to automate and heavily dependent on manual labor.

Foxconn Technology Awards 2026 Winners Announced

06/12/2026 | Foxconn
The winners of the “ 2026 Hon Hai Technology Award” , organized by the Hon Hai Education Foundation , were announced.

NEURA Robotics Announces Record Series C of up to $1.4 Billion

06/12/2026 | BUSINESS WIRE
NEURA Robotics, the pioneer in cognitive robotics and creator of the Neuraverse, announced a landmark Series C financing with a total round size of up to $1.4 billion to accelerate its mission of building the world’s leading Physical AI platform.

SEMI 3D & Systems Summit to Spotlight Heterogeneous Integration for Europe's Semiconductor Future

06/12/2026 | SEMI
The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in Dresden, will bring together the world’s foremost experts in advanced semiconductor packaging and heterogeneous systems integration.

Flex to Join S&P 500 Index

06/12/2026 | Flex
Flex announced it has been selected to join the S&P 500 Index, effective prior to the open of trading on Monday, June 22, 2026.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in