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Advanced Electronics Packaging Digest

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Infineon to Build Europe’s First 300mm GaN Power Semiconductor Fab

10/27/2026 | Infineon
Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.

Compal, ARC Cloud Forge Strategic Partnership to Accelerate Large-Scale AI Infrastructure

10/27/2026 | PRNewswire
Compal Electronics, Inc. and ARC Cloud announced the signing of a Memorandum of Understanding (MOU) to advance their strategic collaboration in large-scale AI computing infrastructure.

UL Solutions Opens Expanded Product Testing Facility in Vietnam

10/27/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced the opening of its expanded Ho Chi Minh City facility, enhancing local testing and compliance support for manufacturers, retailers and brands in Vietnam and Southeast Asia.

Faraday Future Announces Completion of FFR’s Acquisition of FF Robotics Business

10/27/2026 | BUSINESS WIRE
Faraday Future Intelligent Electric Inc. announced at the deal closing and its first Investor Day event in New York that it had completed its acquisition of FFAI’s robotics business and related assets on October 23, 2026.

Karman Selected to Develop Parachute System for NASA’s SkyFall Mars Mission

10/27/2026 | BUSINESS WIRE
Karman Space & Defense has been selected by NASA’s Jet Propulsion Laboratory (JPL) to design and develop the parachute deployment system, referred to as a mortar, for NASA’s SkyFall mission to Mars.
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