Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
July 28, 2025 | Technica USAEstimated reading time: 1 minute
Technica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Bill brings with him a wealth of experience in Essemtec’s advanced equipment and technology. His seven years of expertise in the PCBA market will provide further support to our customers in identifying effective application solutions and addressing challenges in their manufacturing processes.
Essemtec, a leading manufacturer of dispensing, jetting, and placement equipment, offers a range of innovative products, including the PUMA 2 —an all-in-one solution ideal for New Product Introduction (NPI) applications and small production runs. This system allows manufacturers to test and validate new designs without disrupting ongoing production lines.
During a recent visit to San Jose for mid-year meetings, the PCBA Sales Team at Technica had the opportunity to meet and welcome Bill to the region and discuss collaborative initiatives aimed at enhancing customer support and engagement.
Jason Perry, President of Technica USA, stated: “We are excited to have Bill based in the Bay Area to work alongside our team to provide application support and demonstrations for our customers. With the
PUMA 2 and TARANTULA systems now installed in our San Jose Demo Center, and Bill’s technical knowledge on hand, we anticipate an increase of interest in conducting demonstrations of Essemtec’s many solutions.”
Bill will be working out of the Technica San Jose facility until the completion of the new Nano-Dimension San Jose office and applications lab.
Contact Yannick Green, ygreen@technica.com, of Technica or Frank Santos, Frank.Santos@nano-di.com, to arrange your private demonstration.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
PARMI USA Expands Mexico Presence with the Addition of Omar Lopez as Sales Manager for Northern Region
07/29/2025 | PARMI USAPARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce the hiring of Omar Lopez as Sales Manager for Northern Mexico.
Technica USA Hosts ASMPT Management Team for Midyear Business Review
07/22/2025 | Technica USATechnica USA was pleased to host the management team from ASMPT for a strategic midyear business review at its headquarters in San Jose, California.
The Chemical Connection: Sales Organization from a Capital Equipment Perspective
07/22/2025 | Don Ball -- Column: The Chemical ConnectionThe sales organization for a capital equipment supplier to the PCB industry tends to differ slightly from a supplier that manufactures and sells circuit boards to their customers. After all, our sales depend on the printed circuit board manufacturer’s sales. If business falls off, you tend to delay or reconsider the need for new or upgraded capital equipment, and then our sales fall off. If your sales go up and you need to increase capacity or replace old equipment, our sales also trend upwards.
Technica USA Introduces Frank Silva as PCBA Representative for Southern CA and Southern NV Territories
07/16/2025 | Technica USATechnica USA is pleased to announce the partnership with veteran Frank Silva as our PCBA Sales Representative, supporting both supply partners and PCBA customers across Southern California and Southern Nevada.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.