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Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
July 28, 2025 | Technica USAEstimated reading time: 1 minute
Technica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Bill brings with him a wealth of experience in Essemtec’s advanced equipment and technology. His seven years of expertise in the PCBA market will provide further support to our customers in identifying effective application solutions and addressing challenges in their manufacturing processes.
Essemtec, a leading manufacturer of dispensing, jetting, and placement equipment, offers a range of innovative products, including the PUMA 2 —an all-in-one solution ideal for New Product Introduction (NPI) applications and small production runs. This system allows manufacturers to test and validate new designs without disrupting ongoing production lines.
During a recent visit to San Jose for mid-year meetings, the PCBA Sales Team at Technica had the opportunity to meet and welcome Bill to the region and discuss collaborative initiatives aimed at enhancing customer support and engagement.
Jason Perry, President of Technica USA, stated: “We are excited to have Bill based in the Bay Area to work alongside our team to provide application support and demonstrations for our customers. With the
PUMA 2 and TARANTULA systems now installed in our San Jose Demo Center, and Bill’s technical knowledge on hand, we anticipate an increase of interest in conducting demonstrations of Essemtec’s many solutions.”
Bill will be working out of the Technica San Jose facility until the completion of the new Nano-Dimension San Jose office and applications lab.
Contact Yannick Green, ygreen@technica.com, of Technica or Frank Santos, Frank.Santos@nano-di.com, to arrange your private demonstration.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Peters, Starteam, and Würth Elektronik Team Up For Digital Coating Technology
10/23/2025 | PetersUnder this heading, the PCB manufacturers Starteam and Würth Elektronik, along with Peters as inkjet coating supplier, have taken the initiative and worked together for months in trusting and target-oriented cooperation, to promote this innovative digital coating technology for solder resists and establish it on the market.