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Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
July 31, 2025 | Nordson CorporationEstimated reading time: Less than a minute
Nordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market. Nordson will host its quarterly webcast on:
- Date: Thursday, August 21, 2025
- Time: 8:30 AM ET
- Link to listen: https://events.q4inc.com/attendee/941741954
Investors who are interested in listening to the webcast, but are not able to participate during the scheduled time, can access the replay by visiting Nordson's investor website.
Nordson Corporation is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries.
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Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S
07/11/2025 | Nordson Test & InspectionNordson Test & Inspection today announced that smartTec will expand distribution of X-Ray and Test Solutions to include Denmark, Norway, Finland, Sweden, Latvia, Lithuania and Estonia.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Nordson Appoints Chase Collier as a Regional Sales Manager for the EDI Product Line
06/11/2025 | Nordson CorporationNordson Corporation, through its Polymer Processing Systems division, has announced the appointment of Chase Collier as a regional sales manager. In this role, Collier will focus on building and maintaining relationships with customers in the United States while providing exceptional technical sales support and service to processors and OEMs.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.