Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
July 31, 2025 | PR NewswireEstimated reading time: 1 minute
LQDX (lik-WID-ix), formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors. Under the terms of the deal, Toyo will acquire certain intellectual property to enable scale-up and distribution, with LQDX (or its affiliates) supplying the Liquid Metal Ink component.
"We are thrilled to complete this transaction with Toyo Aluminium," said Simon McElrea, LQDX CEO. "Toyo Aluminium K.K has made a deep investment in the development of ACL™ technology, and their unique aluminum expertise enables continuing innovation and scale-up in the critical fields of advanced semiconductor packaging and fine-line IC-substrates."
"Toyo Aluminium is committed to co-creation with leading companies in the substrate industry, which is prototyping of innovative substrates that leverage our proprietary aluminum technology," stated Katsura Morioka, Executive Officer, Toyo Aluminium K.K. "Incorporating LQDX's ACL™ Intellectual Property into our company's portfolio aligns with the expansion of our manufacturing business for Japan, Asia, and the US."
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Solder Joint Reliability With IMS Materials
10/13/2020 | Pete Starkey, I-Connect007Pete Starkey had the opportunity to attend a technical webinar on thermal management hosted by American Standard Circuits and featuring Ventec International Group’s range of insulated metal substrate materials. The webinar was moderated by Anaya Vardya, president and CEO of American Standard Circuits, and the speakers were Ventec’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. The group identified factors that influence thermo-mechanical robustness and provided a logical solution.
Surface Treatment Enabling Low-Temperature Soldering to Aluminum
07/15/2019 | Divyakant Kadiwala, Averatek CorporationAn increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.
Understanding High Efficiency of Deep Ultraviolet LEDs
02/25/2019 | Tohoku UniversityDeep ultraviolet light-emitting diodes (DUV-LEDs) made from aluminium gallium nitride (AlGaN) efficiently transfer electrical energy to optical energy due to the growth of one of its bottom layers in a step-like fashion.
Magnesium vs CFRP: IDTechEx Reveals the Industry Trends
05/11/2018 | PRNewswireThe need for lightweighting is paramount across numerous sectors and understanding the material solutions has left a significant amount of uncertainty and potential opportunities.
New Materials for Sustainable, Low-cost Batteries
05/04/2018 | ETH ZurichThe energy transition depends on technologies that allow the inexpensive temporary storage of electricity from renewable sources. A promising new candidate is aluminium batteries, which are made from cheap and abundant raw materials.