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Advanced Electronics Packaging Digest

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Hon Hai Education Foundation, NTNU Promote AI Education in High Schools

09/11/2026 | Foxconn
The Taichung City Government Education Bureau and Taipei City jointly launched a teacher training workshop.

Airbus, Unseenlabs to Develop France’s Future Military Signal Intelligence Satellites

09/11/2026 | Airbus
On the sidelines of the International Space Summit, Catherine Vautrin, France’s Minister for the Armed Forces and Veterans’ Affairs, announced that the Directorate-General for Armament (DGA) had awarded the CASSIOPÉE contract to Airbus Defence and Space as the lead contractor and its co-contractor Unseenlabs, thereby initiating the renewal of France’s space-based signal intelligence (SIGINT) capability.

Mobix Labs Secures Initial F-16 Component Order

09/11/2026 | BUSINESS WIRE
Mobix Labs, Inc., a U.S.-based provider of advanced electronic components and connectivity solutions for aerospace, defense and mission-critical applications, announced that it has secured its initial production order for components supporting the F-16 Fighting Falcon, one of the most widely operated frontline fighters in the U.S. Air Force.

Rigetti Signs $100M U.S. Government Agreement for Quantum R&D

09/11/2026 | Globe Newswire
Rigetti Computing, Inc., a pioneer in full-stack quantum-classical computing, announced that its wholly owned subsidiary, Rigetti & Co, LLC, has signed a definitive agreement with the U.S. Department of Commerce for an award of $100 million in funding to accelerate superconducting quantum computing R&D.

RapidDirect Launches PCB Division to Integrate PCB and Mechanical Manufacturing

09/11/2026 | Globe Newswire
RapidDirect, a leading global provider of custom on-demand digital manufacturing, announced the official launch of its new Printed Circuit Board (PCB) division.
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