The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging at SEMICON Taiwan 2025
August 18, 2025 | Nordson Electronics SolutionsEstimated reading time: Less than a minute
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.
On display will be the ASYMTEK Vantage dispensing system, configured with two ASYMTEK IntelliJet jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today’s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.
Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations.
The theme for SEMICON Taiwan 2025, “Leading with Collaboration. Innovating with the World,” will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Zhen Ding Builds a New Blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT”
10/22/2025 | Zhen DingZhen Ding builds a new blueprint of “Semiconductor + Advanced Packaging + PCB” “One ZDT” strategy rides the wave of heterogeneous integration to seize the AI industry high ground.
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Pixelworks Announces Definitive Purchase Agreement to Sell its Shanghai Semiconductor Subsidiary to VeriSilicon
10/16/2025 | PRNewswirePixelworks, Inc., a leading provider of innovative video and display processing solutions, today announced that it has signed a definitive agreement to sell its shares in Pixelworks Semiconductor Technology (Shanghai) Co., Ltd., a company organized under the laws of the People's Republic of China and a subsidiary of Pixelworks, to a special purpose entity led by VeriSilicon Microelectronics (Shanghai) Co., Ltd.
DuPont Board of Directors Approves Qnity Distribution
10/16/2025 | QnityDuPont announced that its Board of Directors has approved the previously announced separation of its Electronics business, Qnity Electronics, Inc.
China Expands Rare Earth Export Restrictions, Tightening Grip on Global Supply Chains
10/16/2025 | I-Connect007 Editorial TeamChina sharply expanded its rare earth export restrictions on Oct. 9, adding additional elements and refining technologies to its control list while imposing stricter rules on foreign users in the defense and semiconductor industries.