Nolan’s Notes: Tariffs, Technologies, and Optimization
Global Sourcing Spotlight: Finding the Balance Between Cost and Quality
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging at SEMICON Taiwan 2025
August 18, 2025 | Nordson Electronics SolutionsEstimated reading time: Less than a minute
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.
On display will be the ASYMTEK Vantage dispensing system, configured with two ASYMTEK IntelliJet jet valves for high productivity and accuracy for semiconductor packaging and microelectronics manufacturing. The Vantage system offers several new and innovative configurations to meet the demands of today’s evolving technologies, like panel-level packaging. The Vantage system is already a popular dispenser in wafer-level packaging operations including high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.
Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations.
The theme for SEMICON Taiwan 2025, “Leading with Collaboration. Innovating with the World,” will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/01/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
UST, Kaynes Semicon Partner to Set Up Rs 3,330 Crore Joint Venture for Semiconductor Manufacturing in India
09/30/2025 | PRNewswireUST, a leading AI and technology transformation solutions company, has announced a strategic investment in Kaynes Semicon, a prominent Indian semiconductor manufacturer.
European Semiconductor Industry Endorses Semicon Coalition's Call for Revised EU Chips Act - Cloned
09/30/2025 | SEMISEMI Europe, along with over 75 semiconductor and microelectronics companies, research and technology organizations (RTOs) and trade associations, officially endorse the Declaration of the Semicon Coalition.
SEALSQ, Kaynes SemiCon Announce Joint Venture to Establish India's First Secure Semiconductor Center
09/30/2025 | Globe NewswireSEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products,, a subsidiary of WISeKey International Holding AG , a global leader in cybersecurity, digital identity, and IoT solutions platform, announced the signing of a Term Sheet with Kaynes SemiCon to form a Joint Venture company, SEALKAYNESQ Ltd, to be established in India.
Space Forge Inc. and United Semiconductors LLC Partner to Develop the Supply Chain for Space-grown Semiconductor Materials
09/29/2025 | Space Forge Inc.Space Forge Inc., the advanced materials company revolutionizing semiconductor manufacturing in space, has announced the signing of a strategic Memorandum of Understanding (MoU) with United Semiconductors LLC, a leading specialist in bulk crystal growth of III-V semiconductor compounds. The agreement formalizes the ongoing collaborative efforts that started over a year ago, marking a significant step forward in strengthening the partnership between the two companies.