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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Element Solutions Declares Q3 Dividend of $0.08 Per Share
August 22, 2025 | BUSINESS WIREEstimated reading time: Less than a minute
Element Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
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Element Solutions Announces Board Leadership Transition
03/24/2026 | BUSINESS WIREElement Solutions Inc, a global and diversified specialty chemicals technology company, announced that Sir Martin E. Franklin, Executive Chairman of the Board, plans to step down from the Board and will not seek re-election at the upcoming 2026 Annual Meeting of Stockholders.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3
03/16/2026 | Vern Solberg -- Column: Designer's NotebookIn just about any industry, time-to-market will establish the difference between the leaders and followers. Any new electronic product introduced into the market must meet or exceed stated performance criteria and provide reliable service to the end user experience. The original single-core monolithic system-on-chip developed for the earlier, less complex applications has long been superseded by the more sophisticated multiple-core variations.
Fraunhofer IPMS Adds Ultratrace Elemental Analysis for Wafers
03/06/2026 | Fraunhofer IPMSThe Fraunhofer Institute for Photonic Microsystems IPMS is expanding its analytical capabilities in the field of wafer contamination.
Element Solutions Announces 2025 Q4 and Full Year Financial Results
02/18/2026 | BUSINESS WIREElement Solutions Inc, a global and diversified specialty chemicals technology company, announced its financial results for the three and twelve months ended December 31, 2025.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 1
01/19/2026 | Vern Solberg -- Column: Designer's NotebookThe development of monolithic (system-on-chip) ICs revolutionized the electronics industry, enabling the creation of heterogeneous products by integrating multiple active elements within the same silicon base, which includes a central processing unit (CPU), memory functions, sensors, and communication tasks.