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Koh Young Highlighting Award-Winning True3D Inspection Solutions at SMTA Guadalajara Expo
August 28, 2025 | Koh YoungEstimated reading time: 2 minutes
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will showcase its full portfolio of award winning inspection systems and AI powered smart factory software at SMTA Guadalajara Expo & Tech Forum on September 17–18, 2025, at EXPO Guadalajara in Jalisco, Mexico. Attendees can experience live demonstrations at the Koh Young Booth 722 and in Repstronics Booth 622.
"Mexico and South America are among our fastest-growing regions, and here in Guadalajara, we have a prime opportunity to engage directly with manufacturers seeking to elevate their quality and efficiency," said Heriberto Cuevas Velázquez, Sales Manager & Team Leader for Mexico and South America at Koh Young America. "Our True 3D inspection portfolio and KSMART analytics suite are designed to help partners reduce defects, improve yields, and accelerate their smart factory transformations."
SMTA Guadalajara is the premier electronics manufacturing events for Mexico, gathering process and quality engineers, production managers, and industry leaders. This year, Koh Young underscores how its solutions empower manufacturers to increase first-pass yield, minimize rework, and extract actionable insights from inspection data.
KY8030-3 – Industry’s Fastest True 3D SPI with Reliable Print Process Control
Having pioneered 3D measurement-based solder paste inspection, Koh Young continues to lead with the KY8030-3. Utilizing patented dual-projection Moiré technology, it provides precise and repeatable 3D solder paste data. Working in real time, it enables manufacturers to improve the print process for consistent quality and higher yield.
Zenith Alpha – True 3D AOI for Unmatched Accuracy
The Zenith Alpha platform is built entirely around True 3D measurement technology—unlike many 2D or hybrid inspection systems. By capturing full 3D profiles of all components, Zenith Alpha delivers reliable results regardless of board or part coloration. Combined with AI-driven analytics, it helps manufacturers detect defects early without compromising throughput.
Neptune C+ – Award Winning In Line 3D Fluid Inspection
Neptune C+ is the industry’s first in-line optical solution for transparent and translucent materials. Using proprietary LIFT (Laser Interferometry for Fluid Tomography), it conducts non-destructive, high-resolution 3D inspection of underfill, conformal coatings, epoxy, and more. It identifies imperfections such as bubbles and cracks while quantifying thickness and coverage with precision.
KY P3 – Precision Pin and Mixed Technology Inspection
As mixed-technology assemblies become more common, the KY P3 delivers comprehensive 3D inspection for pins and connectors. It evaluates critical parameters including pin height, coplanarity, shoulder height, and fork-pin spacing—ensuring mechanical integrity and assembly reliability in automotive, industrial, aerospace, and high-reliability applications.
KSMART – Turning Inspection Data into Insight
KSMART, Koh Young’s AI-powered smart factory software suite, aggregates inspection data across production lines. It enables real time decision making, defect traceability, and automated process optimization, helping manufacturers reduce false calls, lower operational costs, and move toward an autonomous smart factory.
"We’re excited to welcome visitors to our booths in Guadalajara. The event gives us a chance to demonstrate in person how our True 3D inspection systems and data analytics suite address manufacturing challenges and support innovation," added Cuevas.
Manufacturers interested in quality improvement and smart manufacturing are invited to visit Koh Young at Booth 722 or Repstronics’ Booth 622 at SMTA Guadalajara Expo & Tech Forum on September 17–18, 2025.
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UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.