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Advanced Electronics Packaging Digest

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Suggested Items

Intel Foundry Uses ASML High NA EUV Technology in Intel 18A Production of Core Ultra Series 3 Processors

07/15/2026 | ASML
ASML Holding N.V. reported that Intel Foundry is using ASML’s High NA EUV technology on the Intel 18A process node to produce a subset of its Intel® Core™ Ultra Series 3 processors.

Intel Names New Leader at Intel Foundry to Accelerate Manufacturing

06/22/2026 | Intel
Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan.

Claros Enters Strategic Manufacturing Collaboration with Samsung Foundry

06/16/2026 | BUSINESS WIRE
Claros announced that it is collaborating with Samsung Foundry on process technology and semiconductor manufacturing to launch high-volume production of Claros’s integrated voltage regulator (IVR).

Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand

05/29/2026 | Cadence Design Systems
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology.

Intel Foundry Push Gains Momentum With Apple as Potential Customer

05/13/2026 | I-Connect007 Editorial Team
Apple’s reported decision to tap Intel as a manufacturing partner for future chips could mark one of the most significant shifts in the semiconductor supply chain in years, with implications that extend well beyond consumer electronics.
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