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Advanced Electronics Packaging Digest

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Suggested Items

Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand

05/29/2026 | Cadence Design Systems
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology.

Intel Foundry Push Gains Momentum With Apple as Potential Customer

05/13/2026 | I-Connect007 Editorial Team
Apple’s reported decision to tap Intel as a manufacturing partner for future chips could mark one of the most significant shifts in the semiconductor supply chain in years, with implications that extend well beyond consumer electronics.

Capacity Cuts and Surging Demand for AI Power ICs Set Stage for Mature-Node Foundry Price Increases

05/07/2026 | TrendForce
The global mature-node supply–demand landscape is undergoing a structural shift, according to TrendForce’s latest foundry industry research.

Everspin Executes $40M Agreement for Mil-Aero MRAM Applications

04/30/2026 | Everspin Technologies, Inc.
Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.

AI Boom to Drive 24.8% Foundry Growth in 2026

03/19/2026 | TrendForce
TrendForce’s latest research on the foundry industry reveals that continued investment in the AI arms race by North American CSPs and AI startups will keep demand for AI processors and supporting ICs strong in 2026.
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