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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Intel Names New Leader at Intel Foundry to Accelerate Manufacturing

06/22/2026 | Intel
Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan.

Claros Enters Strategic Manufacturing Collaboration with Samsung Foundry

06/16/2026 | BUSINESS WIRE
Claros announced that it is collaborating with Samsung Foundry on process technology and semiconductor manufacturing to launch high-volume production of Claros’s integrated voltage regulator (IVR).

Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand

05/29/2026 | Cadence Design Systems
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process technology.

Intel Foundry Push Gains Momentum With Apple as Potential Customer

05/13/2026 | I-Connect007 Editorial Team
Apple’s reported decision to tap Intel as a manufacturing partner for future chips could mark one of the most significant shifts in the semiconductor supply chain in years, with implications that extend well beyond consumer electronics.

Capacity Cuts and Surging Demand for AI Power ICs Set Stage for Mature-Node Foundry Price Increases

05/07/2026 | TrendForce
The global mature-node supply–demand landscape is undergoing a structural shift, according to TrendForce’s latest foundry industry research.
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