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Advanced Electronics Packaging Digest

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RTX's Raytheon Advances Joint Reduced Range Rocket with Third Successful Test

11/09/2026 | RTX
Raytheon, an RTX business, demonstrated its DeepStrikeTM JR3 solution for the U.S. Army's Joint Reduced Range Rocket program during a third successful flight test.

NOTE Finland Joins PIA to Strengthen Defense Industry Collaboration

11/09/2026 | NOTE
NOTE Finland provides electronics manufacturing services ranging from prototypes to series production, including PCBAs and complete box-build products.

onsemi, Czech Ministry Agree to End SiC Expansion Project

11/09/2026 | onsemi
onsemi and the Czech Ministry of Industry and Trade confirmed that they will not proceed with the planned expansion to add end-to-end silicon carbide (SiC) production at onsemi's Rožnov pod Radhoštěm site, first announced in June 2024.

Finetech Expands Volume Production Portfolio, Appoints André Thiemann Co-CEO

11/06/2026 | Finetech
Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André Thiemann became Co-CEO on November 1.

HexaTech Announces 100 mm Diameter Aluminum Nitride Substrate Product

11/04/2026 | PRNewswire
HexaTech, Inc. announced the immediate production release of its new 100 mm diameter single crystal aluminum nitride (AlN) substrate product.
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