Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
September 15, 2025 | HanwhaEstimated reading time: 1 minute
Hanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
This contract brings the two aerospace and defense technology companies together to collaborate in the critical field of advanced guidance technology. The collaboration will leverage BAE Systems’ world-renowned expertise in military GPS and anti-jamming solutions to counter sophisticated electronic warfare threats.
"The purpose of this cooperation with BAE Systems is to secure advanced electronic warfare protection technology to protect our guided weapon systems," said Billy Boo-hwan Lee, the Head of PGM Business Group of Hanwha Aerospace. “Based on a technological advantage to counter electronic warfare threats, we will strengthen our position in the global market.”
“Our collaboration with Hanwha will help give operators added versatility in the field when they need it most,” said Luke Bishop, Director of Navigation and Sensor Systems at BAE Systems. “That versatility combined with our highly reliable military GPS products provides users with a product they can trust will work in the most contested environments.”
Hanwha's Deep Strike Capability system provides a flexible, multi-caliber, and multi-range rocket launch capability, adaptable to diverse missions, from suppressing enemy fire support to neutralizing targets in complex environments. Furthermore, its dual-launcher configuration allows the deployment of a wide range of guided rockets from a single platform, delivering superior firepower and operational flexibility.
The new guidance system, developed through this collaboration, is expected to provide Hanwha’s Deep Strike Capability system with superior precision and operational reliability, even in highly contested electronic environments.
This initiative is strategically engineered to meet NATO interoperability requirements, significantly enhancing the marketability of the system to European and other allied nations.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.