Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Flexible Thinking: ‘Let There Be Light’–Emitting Diodes!

07/27/2026 | Joe Fjelstad -- Column: Flexible Thinking
Display technology has become ubiquitous in today’s electronic products, driven largely by smartphones. This touchscreen technology increasingly dominates our means of communication, both for voice and text. Our connection to the world outside our homes, cars, and offices is now enjoyed 24/7 via the internet, to which they are invariably connected. In terms of time and rate of social change, such devices have gone from “nice to have” to “indispensable” in the seeming blink of the proverbial eye.

Smartphone Shipments Fall 6.7% in Q2 2026 Amid Memory Crisis

07/14/2026 | IDC
The global smartphone market shrank 6.7% year-on-year to 277.5 million units in the second quarter of 2026 (2Q26), according to the preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.

Edge AI Semiconductor Market Size to Hit $151.30 Billion by 2035

07/10/2026 | Globe Newswire
The global Edge AI Semiconductor Market Size was valued at $25.36 Billion in 2025 and is projected to reach $151.30 Billion by 2035, growing at a CAGR of 19.57% during 2026–2035.

AI Chip Shortage, Foundry Cuts to Extend Mature-Node Price Hikes in 2027

06/30/2026 | TrendForce
TrendForce’s latest research reveals that rising demand for AI servers, general-purpose servers, and edge AI devices is prompting foundries to dedicate an increasing share of wafer capacity to AI-related products.

Qualcomm, Hugging Face Expand AI Partnership from Device to Cloud

06/29/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in