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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Armstrong Asia Signs MOU with Checkmate Capital Group to Explore Strategic Collaboration
September 15, 2025 | GlobeNewswireEstimated reading time: 1 minute
Armstrong Asia, a leading Singapore-based manufacturer of flexible material solutions with 16 factories across 7 countries in Asia, has signed a Memorandum of Understanding (MOU) with Checkmate Capital Group, LLC (“Checkmate Capital”), a U.S.-based investment and advisory firm active in the Asia-Pacific and North American regions, focused on cross-border transactions in the life sciences, medical technology, and other industries.
The MOU marks the beginning of a formal relationship between the two companies, following Armstrong’s successful collaboration with NeuroSigma, Inc (“NeuroSigma”), a Los Angeles-based bioelectronics company and a portfolio company of Checkmate Capital. Armstrong has supported NeuroSigma in building efficient and scalable supply chains for its products.
This agreement will serve as a platform for Armstrong and Checkmate Capital to explore additional areas of collaboration, particularly in the evolving medical device industry.
Ms. Phyllis Ong, Group CEO of Armstrong Asia, said: “This MOU reflects our ongoing efforts to expand Armstrong’s contribution to the medical device industry by building strategic relationships. Our work with NeuroSigma demonstrated the value of combining advanced engineering capabilities with responsive supply chain solutions, and we are pleased to take this next step with Checkmate Capital Group.”
Mr. C. Thomas Paschall, CEO of Checkmate Capital Group, commented: “We are pleased to formalise our relationship with Armstrong Asia. Armstrong’s support of NeuroSigma’s supply chain needs has demonstrated the strong capabilities and reliability they bring to the table. We look forward to exploring additional opportunities to work together in the future.”
This partnership supports Armstrong’s long-term vision of becoming a world-class manufacturing gateway that enables smarter, safer, and greener innovation through trusted partnerships.
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Punching Out: M&A Deals in North American PCB and EMS Sectors for 2025
02/19/2026 | Tom Kastner -- Column: Punching Out!Mergers and acquisitions activity in the EMS and PCB sectors in North America in 2025 was certainly slow compared to previous years as well as compared to expectations. When we started 2025, there was a feeling that with a deal-making president coming into office, it would be a positive factor. Baby Boomers were riding a silver wave of retirements and there was a ton of dry powder private equity money waiting to buy their businesses. Private equity-owned firms were looking for acquisitions to grow their companies and there was a big network of young entrepreneurs looking to take out SBA loans and buy board shops.
Navigating the Shift: Key Trends Shaping Growth in AI and Electronics Through 2026
02/02/2026 | Dr. Shawn DuBravac, Global Electronics AssociationGlobal Electronics Association's Chief Economist Shawn DuBravac offers guidance on how companies can successfully navigate challenges and seize new opportunities in this dynamic industry. First, he says, economic growth will remain dangerously narrow. Prosperity will concentrate on artificial intelligence infrastructure, defense electronics, and high-income consumer spending, while companies outside these lanes face headwinds.
Dan’s Biz Bookshelf: ‘Deep Future: Creating Technology That Matters’
01/08/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfIn his book "Deep Future: Creating Technology That Matters," Pablos Holman reveals that we’ve been living in a world obsessed with apps and ad clicks (what he calls “shallow tech”) while the true foundations of civilization (energy, food, infrastructure, and materials) inch along. Holman makes the case that “deep tech”—the stuff that moves atoms—is the lever we need if humanity wants to scale, survive, and thrive.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/07/2025 | Marcy LaRont, I-Connect007In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly.
Nvidia, Microsoft, and BlackRock Lead $40 Billion Deal to Acquire Aligned Data Centers
10/16/2025 | I-Connect007 Editorial TeamA consortium including Nvidia, Microsoft, BlackRock, and Elon Musk’s xAI has agreed to buy Aligned Data Centers in a deal valued at about $40 billion, marking one of the largest-ever data infrastructure acquisitions as tech giants race to expand capacity for artificial intelligence, the Associated Press reported on Oct. 14