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Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
September 18, 2025 | AismalibarEstimated reading time: 1 minute
Aismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
Featured Innovations
- COBRITHERM ALP – A thermally conductive/dielectric aluminum substrate combining high dielectric strength (up to 10 kV) with superior thermal conductivity (2.2–3.2 W/mK). Ideal for EV batteries, telecom, and high-voltage systems, it reduces assembly time and cost while supporting automated PCB assembly.
- THIN LAM – Thermal FR4 for Multilayer PCBs – Optimized for SiC and GaN devices, THIN LAM lowers device temperatures by ~20°C compared to standard FR4, delivers >7% higher power throughput, and eliminates the need for thermal vias, improving reliability and simplifying PCB design.
- AirGapFiller for better heat flow in Electronic Power Modules – A surface-adaptive coating that fills microscopic voids at just 35–40°C to improve thermal contact, reduce resistance, and enhance heat dissipation in electronic power modules.
- Bond Sheet Cured (Glass-Free) – A high-performance insulation and thermal transmission material offering dielectric strength up to 10 kV, thermal conductivity up to 3.2 W/mK, and ultra-low thermal resistance (as low as 0.031 K/W). Clean, flexible, and fiber-free, it ensures long-term stability in demanding EV and industrial applications.
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Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.