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Jiva Leading the Charge Toward Sustainable Innovation

09/30/2025 | Marcy LaRont, PCB007 Magazine
Environmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.

Space Forge Inc. and United Semiconductors LLC Partner to Develop the Supply Chain for Space-grown Semiconductor Materials

09/29/2025 | Space Forge Inc.
Space Forge Inc., the advanced materials company revolutionizing semiconductor manufacturing in space, has announced the signing of a strategic Memorandum of Understanding (MoU) with United Semiconductors LLC, a leading specialist in bulk crystal growth of III-V semiconductor compounds. The agreement formalizes the ongoing collaborative efforts that started over a year ago, marking a significant step forward in strengthening the partnership between the two companies.

Nordson Electronics Solutions Enables Seamless Integration of Actnano PFAS-Free Coatings With Asymtek Select Coat Conformal Coating Systems

09/23/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces full compatibility of its industry-leading ASYMTEK conformal coating systems with actnano’s next-generation, PFAS-free materials.

Curing and Verification in PCB Shadow Areas

09/17/2025 | Doug Katze, Dymax
Design engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.

Marcy’s Musings: Advancing the Advanced Materials Discussion

09/17/2025 | Marcy LaRont -- Column: Marcy's Musings
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