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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/26/2026 | Marcy LaRont, I-Connect007
Amid AI, automation, advanced manufacturing, and an increasingly uncertain global business climate, our industry is moving at an electric pace. My must-reads for this week explore some of the ideas and technologies that help us keep up with so much change. Tom Kastner reminds us why staying focused may be one of the most valuable business skills, especially when navigating mergers and acquisitions. From Lithuania, robotics expert Aurelijus Beleckis makes a compelling case that automation is no longer just about ROI; it may be the key to long-term survival...

Automation as a Survival Strategy

06/24/2026 | Marcy LaRont, I-Connect007
At the EIPC Summer Conference, Aurelijus Beleckis, head of robotics at Lithuania-based Elinta Robotics, challenged manufacturers to rethink how they evaluate automation investments. Elinta has been growing its robotics business for 10 years and is the leading Lithuanian company in this market.

Green Circuits Names Adam Szychowski Chief Revenue Officer

06/23/2026 | Green Circuits
Green Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, has appointed Adam Szychowski as Chief Revenue Officer (CRO).

It’s Only Common Sense: Just Imagine…

06/22/2026 | Dan Beaulieu -- Column: It's Only Common Sense
There’s an old story that says we're all artists in first grade. Just ask a room full of 6-year-olds. One kid draws dinosaurs wearing sneakers. Another builds a spaceship out of cereal boxes and glue sticks. Somebody paints the sky green because they feel like it. Nobody apologizes for their ideas or worries about being judged. They just create without fear. But, as the story goes, we get older. We become more experienced and practical. We learn rules, structure, and how business is “supposed” to work. We slowly trade crayons for spreadsheets and imagination for caution. Little by little, we retire the most creative part of ourselves long before we retire from work.

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.
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