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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/10/2025 | Nolan Johnson, I-Connect007
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.

Marco Pieters Appointed ASML Chief Technology Officer

10/09/2025 | ASML
ASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.

SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years

10/09/2025 | SEMI
Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.

Lam Research Receives 2025 SEMI Award for North America

10/08/2025 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Lam Research Corp. as the recipient of the 2025 SEMI Award for North America.

Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona

10/08/2025 | Amkor Technology
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.
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