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UHDI Fundamentals: UHDI Technology and Automated Inspection

11/03/2025 | Anaya Vardya, American Standard Circuits
Following up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.

Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology

10/30/2025 | Real Time with...SMTAI
Joel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.

Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025

10/28/2025 | Koh Young
Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.

New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection

10/22/2025 | I-Connect007
In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.

Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing

10/14/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
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