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Light-curable Solutions for Reliable Electronics in Space Applications
October 15, 2025 | Virginia Hogan, DymaxEstimated reading time: 2 minutes
Designing electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Critical concerns in space electronics are outgassing and ionic contamination. In vacuum environments, volatile compounds released from adhesives or coatings can deposit on optical surfaces or sensitive instrumentation, degrading performance. Similarly, ionic residues can lead to corrosion or electrical leakage, especially in high-density printed circuit board (PCB) assemblies. These risks are amplified in space, where failure is not an option, and maintenance is impossible.
To address these concerns, engineers increasingly rely on materials that meet strict standards for low outgassing (e.g., NASA ASTM E595) and low ionic content (e.g., MIL-STD 883 Method 5011). Selecting coatings and adhesives that conform to these specifications helps ensure cleaner PCBs and more stable electrical performance in board-level electronics over time.
Mechanical durability is another critical factor. Launch environments subject electronics to intense vibration and shock, while orbital conditions introduce repeated thermal cycling. Adhesives used for staking, bonding, or encapsulating board-level components must maintain integrity under these stresses without cracking, delaminating, or shifting. Non-slumping behavior and long open times are also important for precise placement during assembly, especially on vertical surfaces or in complex geometries.
Equally important is the ability to streamline manufacturing. Light-curable solutions offer a distinct advantage here, enabling fast, room-temperature processing without the need for ovens or solvents, which reduces thermal stress on components and supports high-throughput workflows. Features like UV fluorescence also simplify inspection and quality control.
Dymax has formulated adhesives and coatings that address these interconnected challenges. Its conformal coatings and ruggedized adhesives are engineered to meet aerospace standards for outgassing and ionic purity, while also providing mechanical resilience and efficient processing. By taking a systems-level approach to material development, these solutions enable design engineers to build board-level electronics that perform reliably in space without compromising manufacturability.
As space systems shrink in size and grow in complexity, the importance of selecting the right materials for board-level electronics early in the design process cannot be overstated. Whether protecting a printed circuit board from moisture and contamination or staking board-level components to withstand vibration, the right material choices can make the difference between mission success and failure.
Formulated with a deep understanding of the challenges engineers face in space electronics, Dymax light-curable adhesives and coatings combine application-specific chemistry, efficient processing, and reliable performance to meet the demands of modern aerospace systems, whether in orbit, in flight, or in development.
For more information about Light-Curable Materials for Aerospace Avionics, click here.
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Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
Knocking Down the Bone Pile: Precision Milling of Underfilled Surface-mount Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
AI Demand Drives PCB Material Market Growth
05/08/2026 | TPCAAs AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.