-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Light-curable Solutions for Reliable Electronics in Space Applications
October 15, 2025 | Virginia Hogan, DymaxEstimated reading time: 2 minutes
Designing electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Critical concerns in space electronics are outgassing and ionic contamination. In vacuum environments, volatile compounds released from adhesives or coatings can deposit on optical surfaces or sensitive instrumentation, degrading performance. Similarly, ionic residues can lead to corrosion or electrical leakage, especially in high-density printed circuit board (PCB) assemblies. These risks are amplified in space, where failure is not an option, and maintenance is impossible.
To address these concerns, engineers increasingly rely on materials that meet strict standards for low outgassing (e.g., NASA ASTM E595) and low ionic content (e.g., MIL-STD 883 Method 5011). Selecting coatings and adhesives that conform to these specifications helps ensure cleaner PCBs and more stable electrical performance in board-level electronics over time.
Mechanical durability is another critical factor. Launch environments subject electronics to intense vibration and shock, while orbital conditions introduce repeated thermal cycling. Adhesives used for staking, bonding, or encapsulating board-level components must maintain integrity under these stresses without cracking, delaminating, or shifting. Non-slumping behavior and long open times are also important for precise placement during assembly, especially on vertical surfaces or in complex geometries.
Equally important is the ability to streamline manufacturing. Light-curable solutions offer a distinct advantage here, enabling fast, room-temperature processing without the need for ovens or solvents, which reduces thermal stress on components and supports high-throughput workflows. Features like UV fluorescence also simplify inspection and quality control.
Dymax has formulated adhesives and coatings that address these interconnected challenges. Its conformal coatings and ruggedized adhesives are engineered to meet aerospace standards for outgassing and ionic purity, while also providing mechanical resilience and efficient processing. By taking a systems-level approach to material development, these solutions enable design engineers to build board-level electronics that perform reliably in space without compromising manufacturability.
As space systems shrink in size and grow in complexity, the importance of selecting the right materials for board-level electronics early in the design process cannot be overstated. Whether protecting a printed circuit board from moisture and contamination or staking board-level components to withstand vibration, the right material choices can make the difference between mission success and failure.
Formulated with a deep understanding of the challenges engineers face in space electronics, Dymax light-curable adhesives and coatings combine application-specific chemistry, efficient processing, and reliable performance to meet the demands of modern aerospace systems, whether in orbit, in flight, or in development.
For more information about Light-Curable Materials for Aerospace Avionics, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
United States PCB Market Projected to Grow to $34.2 Billion by 2033
11/11/2025 | Globe NewswireThe United States printed circuit board market is expected to reach US$ 34.2 billion by 2033 from US$ 23.58 billion in 2024, with a CAGR of 4.22% from 2025 to 2033.
SCHMID Group Secures Major Orders for PLP and mSAP Production Equipment
11/11/2025 | SCHMID GroupSCHMID Group, a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing, announced the successful acquisition of two significant orders in the fast-growing field of Panel Level Packaging and mSAP production equipment.
Schweizer Electronic Boosts Orders 140%, Raises Full-Year Outlook
11/10/2025 | Schweizer Electronic AGThe SCHWEIZER Group increased its order intake by more than 140 percent and its revenue by 15.8 percent compared to the same period of the previous year.
Ventec to Exhibit Latest Materials and Machinery for Cutting-edge PCB Production at productronica 2025
11/05/2025 | Ventec International GroupVentec International Group will present advanced materials at Productronica 2025 in Munich, ushering in the ‘Glass Free Revolution’ with the latest and pro-bond & thermal-bond bondply materials.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.